SE-5AT Semiconductor Series | Optical Testing Equipment
Intelligent automatic wafer thickness dual-axis measurement equipment
Multifunctional wafer measuring instrument, using upper and lower high-precision white light concentric focus sensors to measure wafer thickness, curvature, bow, etc.
3D measurement technology
Intelligent automatic wafer thickness measurement equipment
Thickness monitoring
Targeting the thickness monitoring requirements of semiconductor wafer grinding, thinning process, CVD deposition, epitaxy and film growth process.
Precise measurement
The wafer bow, curvature and thickness uniformity generated during the process are accurately measured and analyzed; a non-contact dual probe sensor is used in conjunction with a high-precision displacement platform to perform full-plane scanning.
Barcode Loading Work Order
Work orders can be provided in the form of barcodes, which can be automatically read according to the customer's format and automatically load measurement parameters for measurement.
Measurement function
The measurement points can be customized. The software has built-in point paths, including 5 points, 9 points, 37 points and customized points, which can achieve multi-point measurement information; the system can also read the wafer's WAFER ID information.
Standard model
Automatic optical testing equipment specifications
Intelligent automatic wafer thickness measurement equipment
Thickness measurement
Curvature measurement
Bow measurement
型號 | 多功能晶圓量測儀 |
|---|---|
晶圓厚度量測範圍 | 50μm-1000μm |
重複精度 | ±3μm |
感測器解析度 | ±0.5μm |
晶圓厚度量測項目 | THK/TTV/WARP/BOW |
* Opposed dual-probe white light concentric focus module
Image Detection
Measurement interface
▍Measure each point according to coordinates
▍3D color image analysis
